Clip-On Heat Sink Assembly Improves Thermal Peformance

28th April 2009

Advanced Thermal Solutions (ATS Europe BV)

ES Admin

0 0

Advanced Thermal Solutions has announced the introduction of superGRIP, a new two-component, attachment system which quickly and securely mounts heat sinks to a wide range of hot running Ball Grid Array (BGA) components, while using a minimal amount of space on the PCB and eliminating the need to drill holes.

The two-part superGRIP system features a plastic frame clip, that fastens securely around the perimeter of a component, and a metal spring clip, which slips through the heat sink’s fin field and locks securely to both ends to the plastic frame. The resulting superGRIP assembly applies steady, even pressure to the component throughout the product lifecycle, improving thermal performance and long-term reliability.

“The superGRIP system is a great addition to ATS’ family of mechanical attachments for heat sinks,” said Joseph Mennucci, engineering manager for ATS. “With this latest edition, ATS now offers two tiers of heat sink clip attachment: maxiGRIP, for general purpose and high performance applications; and superGRIP, for high performance applications with densely populated PCBs and little space around the component for mechanical attachment.”

Like its cousin maxiGRIP, ATS’ superGRIP heat sink attachment system permits the use of high performance phase changing thermal interface materials that improve heat transfer by as much as 20 times over typical double-sided adhesive thermal tapes. Both superGRIP and maxiGRIP™ allow for the heat sink to be detached and reattached without damaging the component or the PCB, an important feature for applications where PCB rework and ease of assembly and disassembly are important.

The superGRIP system is available with ATS’ maxiFLOW family of heat sinks, which feature a low profile, spread fin architecture to maximize surface area for more effective convection (air) cooling. Testing at an air flow rate of just 0.5 m/s (100 ft/m) shows that device junction temperatures (Tj) can be reduced by more than 20 percent below the temperatures achieved using heat sinks with traditional fin styles.

ATS will initially be offering 51 superGRIP/maxiFLOW heat sink and attachment assemblies, available from ATS for 17 component sizes, from 15 mm x 15 mm to 45 mm x 45 mm, and heat sink heights of 7.5 mm, 12.5 mm and 17.5 mm. The superGRIP system will also be available with ATS’ straight fin and cross cut heat sinks, as well as additional sizes, as custom options.