CeramCool is said to be the ideal base for the thermal management of high power electronic systems. CeramCool is available from ceramic materials such as Rubalit 708, Alunit and other materials upon request. The materials have a thermal expansion coefficient that is adapted to semiconductor materials, possess excellent electrical characteristics and are at the same time corrosion-resistant.
CeramCool can be metallized directly with thick or thin film processes such as conventional ceramic substrates. This makes the complete surface of the heat-sink useable as a circuit carrier while providing reliable electrical insulation.