The Pixus ATR Series offers various sizes and configurations of enclosures, in both fan convection and conduction-cooled versions. This includes sizes in 1/2 and 3/4 in the long and short ARINC formats. Backplanes are available off-the-shelf or customized in CompactPCI, MicroTCA, OpenVPX, VME/64x, and other architectures. Pixus has a highly experienced team in packaging the power, cooling, enclosure, backplane, I/O, and other components for a complete ATR solution. The company also utilizes the standard enclosure frame options of industry partners to offer customers a tailored design to their application.
The 1/2 ATR short enclosure features dip-brazed or screwed and glued” options depending on the needs of the application. With a special milling process and tooling, the frames are typically significantly more cost-effective in manufacturability, while exceeding quality expectations. Pixus Technologies stems from the former Kaparel team and leverages proven backplane and enclosure solutions that have been deployed for the last 20 years. The company has a vast selection of unique backplane configurations with or without integrated power connectors, that are well-suited for ATR applications.