ADL Embedded Solutions Announces High Ingress-Protection ADLMES-8200 Modular Enclosure

ADL Embedded Solutions today has announced its New High IP Modular Enclosure, ADLMES-8200. The ADLMES-8200 is a highly configurable, modular enclosure system aimed at quick-turn delivery of rugged or extended temperature enclosures for a variety of applications.

The modular sidewall design supports variable PC/104 stack heights, ADL Embedded Solutions’ 3.5 SBCs and other SBC Intelligent Systems. Quick-turn, high IP systems are made possible through the modular architecture of the ADLMES-8200, high-availability of inventory, quick-turn custom faceplate/backplate support and readily available high-IP connectors. The finned-chassis design allows for conduction cooling through the base to airframe or vehicle bulkhead or passive cooling via the finned chassis surface which can be augmented with forced cooling. Up to IP65 Ingress-Protection is possible with appropriate faceplate and connector options.

The ADLMES-8200 is only available as part of a full system and is fully supported by ADL Embedded Solutions’ team of Solidworks engineers to provide design and 3D modeling support. Full quick-turn system solutions including internal hardware is made possible through ADL Embedded Solutions’ broad portfolio of PC/104 SBC options ranging from low-power microarchitectures like the Intel Atom (Z510/Z530, D525 Pineview and N2600 Cedarview) to high-performance 2nd generation Intel Core i7 Quad platforms like the ADLQM67PC. ADL Embedded Solutions’ offers compatible power supply options (ADLPS35 and ADLPS104) for simple and high-pow­ered systems as well as a broad range of peripheral options.

“According to JC Ramirez, ADL Embedded Solutions Product Manager, “Quick time-to-market has become a critical success factor for many embedded engineers and solutions providers. The ADLMES-8200 modular enclosure helps ADL Embedded Solutions’ fill this need by synergistically combining it with our broad portfolio of SBCs, power supplies, and design services to cut time-to-market by half or more in most cases.”

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