Top 5 board products in April

28th April 2023
Paige West

Electronic Specifier takes a look at the top five board products to have been released in April 2023.

iWave's 64-bit Arm-A55 and RISC-V MPU-based System on Module

iWave Systems has announced an upcoming iW-RainboW-G53M: RZ/G2UL, RZ/A3UL, RZ/Five based System on Module (SOM) built on OSM v1.1 Size-M specification at the Embedded World 2023 trade fair.

The module delivers sophisticated features and enhanced performance for IoT endpoint devices while reducing overall costs.

RZ/G2UL, RZ/A3UL, and RZ/Five MPUs are available with the same pin package enhancing the compatibility of the SOM architecture. Using the same pin package assignment and peripheral functions across different MPUs, the SOM lets the customer choose either the Cortex-A55 core to target Linux-based HMI applications or the RISC-V AX45MP core, depending on their needs.

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TEWS introduces high-density simulation PMC

TEWS Technologies adds to its high-density embedded I/O product line with the introduction of the TPMC543, a standard 32-bit 33MHz single-wide PCI Mezzanine Card (PMC) module optimised for simulation applications and industrial control, traffic control, and COTS requirements.

The TPMC543 offers high density channels with current inputs, current outputs, high-voltage inputs, and standard voltage outputs in a single PMC module. Support of sensors for two, three, and four-wire current transmitters and support of higher voltage analogue inputs are featured.

The TPMC543-10R features four multiplexed multi-channel 16bit ADC devices, each device providing either eight single-ended or four differential A/D channels.

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MicroSys introduces evaluation kit for NXP S32G

MicroSys Electronics announces a new evaluation kit for its miriac System-on-Modules based on NXP Semiconductors S32G processor family.

Deployed in vehicle networks as headless controllers, these highly integrated and performance scalable processors support ADAS and other functions for increasingly autonomous vehicles.

Developers can use the new miriac evaluation platform, which is designed as a modular single board computer (SBC), to test the performance balancing of their applications and to connect their CAN-, LIN-, FlexRay- and 100BASE-T1-based peripherals via automotive connectors. The evaluation kit includes NXP S32G274A and/or new NXP S32G399A based miriac System-on-Modules, a carrier board in the shape of a dedicated modular SBC, as well as the appropriate power supply, cable sets and a pre-installed Linux image.

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eInfochips unveils reference development platform for NXP processor

eInfochips has launched a Reference Development Platform (RDP) based on NXP Semiconductors’ i.MX 93 applications processors.

“As an early access partner for the NXP i.MX 93 platform, eInfochips is proud to offer our clients a cutting-edge reference development platform. This platform enables customers across smart home, smart city and industrial verticals to quickly prototype their ideas and bring them to reality”, says Parag Mehta, chief sales, and business development officer at eInfochips.

The EIC-i.MX93-210 is an RDP kit based on NXP’s i.MX 93 applications processor. The processor includes the scalable Arm Cortex-A55 Core, which enables efficient machine learning acceleration and advanced security with an integrated EdgeLock secure enclave to support edge computing.

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ET980 COM express module with 12th gen Intel processors for Edge computing

IBASE Technology has added the ET980 series of COM Express modules to its portfolio.

Supporting the U-series and P-series of 12th Gen Intel Core processors from i3-1220PE to i7-1265UE (12M Cache, up to 4.70GHz), ET980 provides a platform with 10-12% boost in productivity performance compared with the previous generation making it a highly versatile device. It is especially suited for applications demanding responsive technology to handle compute-intensive tasks simultaneously, such as medical instruments, industrial automation and control, robotics, and embedded gaming.

"The new ET980 COM Express module is ideally suitable for use in high-performance IoT edge computing and offers our customers the shortest time to market," said Wilson Lin, Director of IBASE Product Planning Department. "It’s upgradability and versatile design provide a competitive advantage, enabling the lower cost of ownership through high configurability and optimum scalability."

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