“This new QSMP-25 solder-down module delivers an industrial-grade 64-bit solution for secure Industry 4.0 and advancedEdge computing applications that require high-end multimedia capabilities,” said David Pashley, Co-Founder and Managing Director, Direct Insight. “Incorporating high performance connectivity, multimedia and display, with a Yocto-build mainline Linux BSP, this SoM simplifies design and production, with its QFN (quad flat no-lead) solder-down package optimising size and price, while simplifying PCB layout and EMI (electromagnetic interference) compliance.”
Manufactured by Direct Insight’s longstanding partner, Ka-Ro Electronics, the new QSMP-25 is a 29mm x 29mm QFN-style solder-down SoM featuring STMicroelectronics STM32MP255F microprocessors. Dual ARM Cortex-A35 processors, clocked at 1.5GHz, are complemented by a 400MHz ARM Cortex-M33 MCU (microcontroller), a 1.24 TOPS NPU for AI/ML tasks, dual MIPI-CSI camera inputs and a powerful GPU (graphics processing unit), as well as an HD 60fps video pipeline.
The QSMP-25 module adds 1GB LPDDR4 RAM, 4GB eMMC and power management, integrated on a tiny footprint QFN package for excellent EMC (electromagnetic compatibility), thermal and cost optimisations. The module is square, with a height of 2.6mm, and requires a single 3.3v supply. A full industrial operating temperature range of -40°C to +85°C is supported.
Furthermore, wide range of interfaces is supported, including dual USB 2.0 (with on-module PHYs), or one USB 2.0 + one USB 3.0, PCIe and dual Gb Ethernet. Other connectivity includes 3x UART, 3x I2C, 2x SPI, PWM, SAI and 3x CAN. Advanced security features support IoT and industrial applications, ready for a CRA-compliant system implementation. The QSMP-25 comes with a dedicated Yocto Scarthgap build, providing a mainline Linux kernel, with full sources and toolchain supplied, as well as extensive documentation.
