Boards/Backplanes

Development kit eases implementation of Bluetooth module

24th February 2014
Mick Elliott
0

MSC Technologies is showing the BMSKTOPASM369BT development kit from Toshiba today (Feb 25) at embedded world 2014 in Nuremberg. The kit is a completely new development platform for Panasonic’s PAN1026 embedded Bluetooth Smart Ready module that recently turned into series production.

Panasonic’s PAN1026 module, which is based on Toshiba’s TC35661 Chiron Bluetooth LSI, features include an output power of +4dBm and a high receiver sensitivity of -87dBm. In addition to the Serial Port Profile (SPP) functions and Bluetooth Low Energy (BLE) GATT profiles already available in the Flash of the PAN1026, a wide variety of additional software packets, which run on a TMPM396 CortexM3 MCU equipped with 512 KB Flash and support interfaces such as Ethernet, CAN, USB, serial and UART, are offered with the BMSKTOPASM369BT starter kit.

Instead of Toshiba Control Unit (TCU) commands supported on the PAN1026 module, a complete high-level SPP API with very easy-to-use instruction sets is available to developers for simple Bluetooth integration, for example, for SPP applications. In addition, a complete Bluetooth Low Energy API based on the GATT profile was implemented for fast BLE profile and application integration. Numerous proposed solutions such as, e.g. a heart-rate demo, enable a significant reduction in development time. Furthermore, developers have access to a large number of BLE profiles via this API. The development of individual BLE profiles is also possible.

An iAP software for iOS6, which enables both simple integration of the Apple authentication chip and integration of the SPP communication in the app on the iOS devices, is

an optional part of the development kit.

In addition to the reference design and a wide range of demos, the development kit contains software source codes and comprehensive application notes.

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