Industrial mainboards available with 2nd gen AMD G-series SoCs

19th August 2015
Siobhan O'Gorman

The Fujitsu D3313-S series of mini-ITX boards are now available in two new AMD Embedded G-series SoC versions. The D3313-S4 with a dual core, 2.2GHz and a cTDP of 10 to 15W and the new D3313-S5 with a quad core, 1.2GHz and a cTDP of 5 to 7W, both use the 2nd gen of AMD G-series SoCs.

The boards offer a significantly improved CPU and graphics performance and configurable TDP values. With the AMD Embedded G-series SoCs comes the boost mode. This can increase the SoC’s frequency, and also includes environment variables such as temperature and adjusted TDP. The temporary increase of performance amounts to up to 200MHz for the D3313-S4 and up to 400MHz for the D3313-S5.

The mini-ITX boards D3313-S1, D3313-S2 and D3313-S3 are characterised by a high graphics performance at low TDP values, and are particularly suitable for use in graphics intensive applications such as digital signage, vending, HMI, kiosk, medical engineering or in boxed embedded PCs. The D3313-S4 and the D3313-S5 complete the portfolio and are also deployable in an extended temperature range from 0 to 60°C. Both boards have the option to configure the TDP through the BIOS according to performance needs. Fujitsu’s strict life cycle management guaranties an availability of five years for its mainboards. BIOS and hardware changes are announced at an early stage and there are detailed ECNs and PDNs.

For all models, Fujitsu offers a kit solution with extensive accessories such as housing, riser cards for expansion cards, TPM 1.2 by Infineon, a wall mounting kit, desk stands, and diverse cables. Additionally there are three cooling solutions for various application scenarios available: a passive cooler for TDP values up to 10W, a passive heat pipe cooler for TDP values up to 15W, and an active cooler with PWM fan control and monitoring for TDP values up to 25W. All parts of the kit solution are CE and FCCB certified and climate-tested. This enables customers to assemble application-specific systems easily and cost effectively.

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