High-performance module can be easily customised

The microprocessor comes in the smallest possible Computer-On-Module (COM) form factor (82 mm x 50 mm).

These small dimensions enable the modules to achieve new levels of computing and graphics performance with excellent low power features and reasonable cost.

The module family is best suited to innovative applications where high graphics performance is required along with low power consumption, such as medical, visualisation, human machine interface (HMI), measurement technology, entertainment and gaming.

The embedded modules are compatible with Avnet Integrated’s new SimpleFlex platform, which can be quickly and easily configured according to customer-specific requirements without any development effort.

The module family is based AMD’s Ryzen Embedded Accelerated Processing Unit (APU) in “Zen” core architecture with up to two CPU cores and four threads. The thermal design power (TDP) ranges from a low 6W to 15W.

An integrated “Vega” GPU with three, up to 1200MHz (1.2GHz) fast, compute units offers graphics performance that outperforms existing devices of a similar small form factor.

Up to three independent 4K displays can be controlled with the processor board.

With the new MSC SM2S-RYZ module family, Avnet Integrated is expanding its extensive SMARC 2.0 module portfolio and offers wide scalability of its modules from the low-cost NXP i.MX6 ULL to the entire NXP i.MX 8 series, the Intel Atom processor E3900 series to the high-performance AMD Ryzen Embedded R1000 series APUs.

The module family can be flexibly equipped with different AMD Ryzen processors.

The R1000 series with R1606G dual core (four threads), 2.5GHz (3.5GHz Boost) with 15W TDP (12 – 25W cTDP) or R1505G dual core (four threads), 2.4GHz (3.3GHz Boost) with 15W TDP (12 – 25W cTDP) or alternative.

The low-power R1000 series with R1305G dual core (four threads), 1.5GHz (2.8GHz Boost) with 8W TDP (6 – 8W cTDP) or R1102G dual core (two threads), 1.2GHz (2.6GHz Boost) with 6W TDP.

Despite the small form factor, the embedded modules have space for up to 16GB DDR4 2400MT/s SDRAM and up to 64 GB eMMC Flash memory. The standardised processor modules are equipped with a Trusted Platform Module (TPM) 2.0.

The MSC SM2S-RYZ module family has 2x DisplayPort 1.4 / HDMI 2.0b and eDP 1.4 / dual-channel LVDS for the connection of three independent displays with a resolution of up to 4K.

Additionally, industry standard interfaces such as SATA-III (6 Gbps), PCI Express (PCIe) Gen3 with up to 4x 1 lanes, Dual Gigabit Ethernet, 4x USB 2.0 and 2x USB 3.1 Gen2 (10 Gbps) are available.

The boards are developed for the embedded market and are available for at least ten years from the product launch of the processor.

Avnet Integrated provides a development platform and starter kit for evaluation and rapid startup of the new modules.

All Avnet Computer-On-Modules (COMs) are manufactured in the company’s fully automated manufacturing facilities in Germany.