Boards/Backplanes

COMs balance space constraints and CPU requirements

9th July 2018
Mick Elliott

Express-BD7 Computer-on-Modules (COMs) from ADLINK Technology, a Premier Member of The Intel Internet of Things Solutions Alliance are in stock at Mouser Electronics. The modules help engineers build space-constrained systems in industrial automation and data communication — such as virtualisation, edge computing or other numerical applications — that require high-density CPU cores balanced by reasonable power consumption.

The COM devices are designed around the Intel Xeon processor D and Intel Pentium processor D systems-on-chip (SoCs) and based on the latest PICMG COM Express 3.0 specification with Type 7 pinout.

This pinout removes graphics support available in Type 6 and replaces it with up to four 10 Gigabit Ethernet (10GbE) ports and an additional eight PCIe ports for a total of up to 32 PCIe lanes.

The modules have dual-stacked SODIMM sockets supporting up to 32 GBytes of DDR4 ECC (or non-ECC) memory, and interface options include USB 3.0/2.0 ports and SATA 6 Gbps ports with support for SMBus and I2C.

Built-in Smart Embedded Management Agent (SEMA) Cloud functionality, which enables remote monitoring, autonomous status analysis, custom data collection, and initiation of appropriate actions in distributed devices is a feature of the modules. All collected data, including sensor measurements and management commands, are available from any place, at any time via encrypted data connection.

The Express-BD7 COM is supported by the ADLINK COM Express Type 7 Starter Kit Plus, which includes everything needed to design and develop COM Express systems based on Type 7 modules.

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