Backplane features high grade laminate material

7th November 2017
Lanna Cooper


Provider of embedded computing and enclosure solutions, Pixus Technologies has released a new 3U OpenVPX high speed backplane in the 6-slot size. 

The 3U OpenVPX backplane meets the BKP-DIS06-15.2.14 profile per VITA 65.

The PCIe Gen3 capable backplane features a high grade laminate material and back-drilling of vias. Rear Transition Module (RTM) connectors are optional for rear I/O access. Conformal coating and customised versions of the backplane are also available.

The slot pitch of the 3U OpenVPX backplane is 1.0”, with 0.80” versions available upon request. Pixus also offers 3U 6-slot backplanes in other VITA 65 backplane profile and speed options. 

Pixus provides OpenVPX enclosures, backplanes, components, and accessories. The company also offers mounting rails and subrack components for CompactPCI Serial, CompactPCI, VME64x, and other architectures.

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