Boards/Backplanes
DEEPX surpasses 300 customer validations
DEEPX, a company specialising in on-device AI semiconductors, announced that its ‘Early Engagement Customer Programme’ (EECP) – ran over the past year in preparation for the mid-year mass-production launch of its first product – has received more than 300 customer validation requests worldwide for its DX-M1 prototype.
Add-on board for Root of Trust
ecure Tropic Click from MIKROE is a compact add-on board designed to provide a hardware-based Root of Trust for embedded systems.
AI performance for COMs with Intel Core Ultra processors
congatec boosts AI performance for medical, robotics, industrial, retail, and gaming applications, delivering up to 99 TOPS.
IMDT expands Edge AI offerings with new SOM and SBC
IMDT announces the launch of its latest System-on-Module (SOM) and Single-Board Computer (SBC) products: IMDT V2N SOM and IMDT V2N SBC. These platforms, built on the newly introduced Renesas RZ/V2N processor, offer a cost-effective, energy-efficient solution for developers seeking to accelerate AI-driven vision applications at the Edge.
TI AI processor powers JUMPtec SMARC module
JUMPtec has released a new SMARC module based on TI’s AM67A scalable edge AI processor, which integrates up to four Arm Cortex-A53 CPU cores at 1.4-GHz, a 4 TOPS neural processing unit (NPU) and an extensive suite of on-device accelerators.
Infineon bolsters dev kits, IDEs range to aid engineers
To further support developers, Infineon has introduced new affordable development kits and free integrated development environments (IDEs), supported by comprehensive software tools, tutorials, and an extensive ecosystem.
COM Express board marks Tria debut at embedded world
Tria Technologies, which specialises in embedded compute boards, introduces the Tria C6C-RYZ8 COM Express Compact Type 6 module at embedded world 2025 in Nuremberg (March 11-13).
Kontron introduces K3881-C and K3882-C µATX motherboards
Kontron expands its portfolio with the K3881-C and K3882-C µATX motherboards, designed and manufactured in Germany.
Direct Insight creates QNX 8 BSP for QS93 i.MX93 solder-down SoM
Direct Insight has created a QNX 8 BSP (board support package) for Ka-Ro’s QS93 solder-down module with NXP’s i.MX93 processor.
Sfera Labs debuts Open X2-Series and new Strato Pi Max Board
Sfera Labs, an innovator in industrial-grade open solutions, has announced the release of the X2-Series Standard Electrical and Mechanical Specifications, an open standard designed to foster innovation and customisation in industrial automation and IoT applications.