At embedded world 2026, 10-12th March in Nuremberg, Germany, Texas Instruments (TI) will exhibit how semiconductor innovation is making autonomy more accessible and scalable across industries. TI’s display in hall 3A, booth 131, will demonstrate how its broad analogue and embedded processing portfolios and comprehensive software and development tool ecosystem help engineers innovate what’s next – from AI-driven development to edge intelligence.
Demonstrations will highlight how TI’s end-to-end AI enablement is transforming customers’ ability to:
- Develop faster with AI: Speed embedded development with generative AI. Just as search engines transformed how we access information, AI is now transforming how we build embedded applications. With integrated generative AI in TI’s CCStudio ecosystem, engineers can use simple language to develop their applications faster using industry standard agents and models fed with TI’s expansive library of technical documentation and examples to accelerate code development, system configuration and debug at any expertise level.
- Enhance performance with edge AI: Optimise performance of any application with Edge AI. Reduce latency, lower energy consumption and minimise memory footprint with integrated AI accelerators to enable machine learning on resource-constrained devices. Paired with access to more than 60 models, use cases, data and training scripts, CCStudio Edge AI Studio enables customers to build intelligent applications at scale.
- Deploy intelligence anywhere: Bring affordable edge AI to any application. With TI’s broad portfolio of edge AI-accelerated and – supported embedded devices, engineers can deploy intelligence at any scale – from small, wearable ECGs to high-performance autonomous vehicles. TI’s portfolio ranges from compact general-purpose MCUs, real-time and wireless MCUs to high-performance SoCs and radar sensors, giving engineers the flexibility to integrate the right level of intelligence for their applications.
- Accelerate innovation through our worldwide partner ecosystem. TI’s partner innovation wall will showcase how the company’s deep collaboration with industry leaders across the world in hardware, software and design services – including premium partners Phytec, TQ and Toradex – provides the complete foundation to bring innovative embedded solutions to market faster.
TI speakers at embedded world 2026
- Wednesday, 11th March– NCC Ost Convention Centre
o 10:00 a.m. Central European time (CET): Schuyler Patton presents “Maintaining Time Synchronization in High Network Traffic Applications” in Session 1.7, IoT & Connectivity – Ethernet Time-Sensitive Networking.
o 1:15 p.m. CET: Han Zhang, Ph.D., presents “Motor Predictive Maintenance Using Edge AI” in Session 8.2, Use Cases for Embedded – Predictive Maintenance Applications.
o 3:00 p.m. CET: Thomas Mauer presents “Simplifying Multi-Protocol Industrial Ethernet: One Design, Every Protocol” in Session 1.9, IoT & Connectivity – Applying Ethernet Technologies.
o 3:00 p.m. CET: Kottyn Quintanilla presents “Applying Artificial Intelligence in Radar Sensing Applications” in Session 6.6, Embedded Vision – Radar and Artificial Intelligence.
- Thursday, 12th March– NCC Ost Convention Centre
o 10:00 a.m. CET: David Fosca Gamarra presents “Deploying Energy-Efficient Machine Learning at the Edge: A Practical Approach” in Session 7.4, Edge AI – Execution.
o 12:15 p.m. CET: Andrew Kutzler presents “DC to AC Conversion With DC to DC Buck Converters for PDLC Displays” in Session 4.8, Hardware Designs – Hardware Design Examples.
o 3:00 p.m. CET: Bhargavi Nisarga presents “Seamless Handover of Bluetooth LE Connections for Enhanced User Experience” in Session 1.15, IoT & Connectivity – Bluetooth in Automotive Applications.
