RF power multi-chip modules support massive MIMO antenna systems

4th December 2019
Mick Elliott

The RF power multi-chip module (MCM) portfolio for 5G mMIMO from NXP Semiconductors is available at distributor Richardson RFPD with full design support. These devices are part of NXP’s 5G Airfast solutions product family.

It includes LDMOS power amplifier modules, GaAs pre-driver modules and receiver modules for cellular frequency bands from 2.3GHz to 3.8GHz, with output power from 3W to 5W.

The fully integrated power amplifier modules feature advanced high-performance in-package Doherty, fully matched 50-ohm input/output, multiple gain stages, and a small footprint.

This combination of features is ideal for scaling mMIMO 5G configuration up to 64T64R.

Key products and features of these RF power MCMs include:

Power amplifier modules*:

AFSC5G37D37 (3.7 GHz band, +37 dBm Avg.)

AFSC5G35D37 (3.5 GHz band, +37 dBm Avg.)

AFSC5G35D35 (3.5 GHz band, +35 dBm Avg.)

AFSC5G26D37 (2.6 GHz band, +37 dBm Avg.)

AFSC5G23D37 (2.3 GHz band, +37 dBm Avg.)

*Evaluation boards are also available.

Pre-driver modules:

AFLP5G35645 (3.5 and 3.7 GHz bands, +29 dBm Avg.)

AFLP5G25641 (2.3 and 2.6 GHz bands, +29 dBm Avg.)

Receiver modules:

AFRX5G372 (LNA+switch for 3.5 to 5 GHz bands)

AFRX5G272* (LNA+switch for 2.3 and 2.6 GHz bands)

*Preproduction device. Samples available upon request.

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