Achieving smaller, thinner and lighter systems can enable significant cost savings and more environmentally friendly base stations, while still achieving the full performance benefits of 5G.
NXP’s family of 5G massive MIMO modules utilize innovative top-side cooling package technology. The first products are designed for 32T32R 200 W radios, covering 3.3 GHz to 3.8 GHz frequency bands.
To realize the benefits of NXP’s top-side cooling, mechanical changes must be incorporated in the RF front-end design.
Richardson RFPD has created a tool that allows designers to quickly view recommended products by frequency band.
Products include power amplifiers, receiver modules, filters, couplers, bias controllers and more.
Featured suppliers include NXP, Analog Devices, CTS Electronic Components, Qualcomm, Trans-Tech, and TTM Technologies.
The Richardson RFPD application engineering team is also available to support the design-in of the top-side cooling modules.
