DF-3020 is available in various thickness formats from 5 to 50µm, ±5%. The cured chemistry can withstand harsh environments, boasting resistance to extreme moisture conditions and corrosive chemicals. The DF-3020 film is less brittle than most negative photo resists on the market with a glass transition temperature of 158°C and a moderate modulus of 3.5GPa at 25°C.
DF-3020 is hydrophobic in nature, providing for chemical and moisture resistance. DF-3020 is compatible with and can be used in contact with the EMS line of spin coatable photoresists. DF-3020 is the latest addition to Engineered Materials Systems’ line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.