3D Printing

Dry-film negative photo resist suits MEMS & TSV sealing

13th January 2015
Barney Scott

Engineered Material Systems is pleased to introduce the DF-3020 dry-film negative photo resist for use in Micro Electro Mechanical Systems (MEMS) and wafer-level packaging applications (TSV sealing). This material formulation has been optimised for hot roll lamination and processing on MEMS and IC wafers.

DF-3020 is available in various thickness formats from 5 to 50µm, ±5%. The cured chemistry can withstand harsh environments, boasting resistance to extreme moisture conditions and corrosive chemicals. The DF-3020 film is less brittle than most negative photo resists on the market with a glass transition temperature of 158°C and a moderate modulus of 3.5GPa at 25°C.

DF-3020 is hydrophobic in nature, providing for chemical and moisture resistance. DF-3020 is compatible with and can be used in contact with the EMS line of spin coatable photoresists. DF-3020 is the latest addition to Engineered Materials Systems’ line of film and liquid negative photo resists formulated for making microfluidic channels on MEMS devices and integrated circuits.

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