This unique project is done in collaboration with Harris Corporation, a leading technology innovator, that provides solutions that connect, inform and protect its clients. Nano Dimension and Harris have entered into a non-binding letter of intent with respect to the collaboration.
This project will demonstrate, for the first time, the manufacturing of 3D printed double sided, multilayer circuits that distribute digital, power and RF signal at the same substrate, thus providing reduced size, weight, power and cost of space systems. New high volume printed RF technology will provide improved reliability and uniformity of space systems by eliminating manual assembly.