KEMET has announced the introduction of a series of gold plated termination options to its high temperature 200°C ceramic capacitor product lines. They were developed to accommodate mission critical, high reliability and high temperature applications where the use of pure tin and tin-lead plating may compromise long term performance and RoHS initiatives, respectively.
Thickness offerings range from 50nm to more than 2.5μm. Furthermore, these options facilitate assembly by wire bonding, conductive adhesive (epoxy bonding) as well as most soldering attachment methods while ensuring improved long term performance and reliability.
Reggie Phillips, Product Line Manager, KEMET, commented: "KEMET's new gold termination options further the company's commitment to supporting customers with increasingly higher temperature requirements. Our patented base metal electrode dielectric technology combined with gold termination translates to a lead-free, RoHS and REACH compliant product capable of continuous and reliable operation up to 200°C."