New webinars on soldering processes and networked systems

22nd September 2022
Sheryl Miles

The start of autumn heralds the latest webinar series from Rehm Thermal Systems. In October, the in-house experts will first talk about the advantages of vapour phase soldering before moving on to the topic of connectivity with communication interfaces in SMT production.

Another webinar will cover the fundamentals of reflow soldering.

The final event in December will be a live webinar on the reduction of void formation in vacuum soldering.

The Rehm webinars offer the opportunity to refresh any background knowledge and gain insight into the practical application of the various Rehm systems.

Live-Webinar: Vapor phase soldering (English)

13.10.2022 / 9.00 a.m. and 4.00 p.m. CET

Do you process large and heavy boards for which convection soldering is out of the question? Or do you need a system with which you can reliably carry out vacuum processes at any time? A Condenso series system that can be customised to the manufacturing environment, and the series system versions can be integrated into a wide range of manufacturing environments.

The German-language webinar on this topic will take place on October 12th at 9:00 a.m. CET.

Live-Webinar: Connectivity – Communication interfaces in SMT production (English)

26.10.2022 / 9.00 a.m. and 4.00 p.m. CET

Industry 4.0 is based on intelligent, digitally networked systems that enable largely self-organised and flexible production. Standardisation and smart software solutions help to achieve this. ‘The Hermes Standard’ (IPC-HERMES-9852) ensures that assembly information is transmitted reliably, spontaneously, simply, and completely from machine to machine and to higher-level systems.

With the CFX interface (IPC-CFX), communication is network-based vertical and is used for data upload and download as well as data analysis. The combination of horizontal Hermes communication and vertical CFX communication is essential for the smart factory in the long term and represents a further step towards standardisation.

The German-language webinar on this topic will take place on October 25th at 9:00 a.m. CET.

Live-Webinar: Reduction of void formation with vacuum (English)

01.12.2022 / 9.00 a.m. and 4.00 p.m. CET

Vacuum soldering significantly reduces gas bubbles in solder joints and has been proven for decades in contact heat and vapour phase soldering systems. But what does this mean with regard to convection soldering, the widely used process with the highest throughput?

In the December webinar Rehm’s experts explain the possibilities of different vacuum soldering processes and show their respective limitations.

The German-language webinar on this topic will take place on November 30th at 9:00 a.m. CET.

Participation in these webinars is free of charge.

Live-Webinar: Fundamentals of reflow soldering (English)

27.10.2022 / 9.30 a.m. CET

In the first part of the basic seminars, Rehm provides the theoretical basis for reflow soldering technology. Offer lectures that optimally introduce the basics or open up a variety of opportunities to refresh knowledge and get ideas for innovative projects.

Take advantage of the opportunity to get a comprehensive overview of manufacturing processes in the electronics industry and to talk to experts from the industry. Using the latest findings from research and development, the team will prepare interesting topics.

The duration of this webinar is 240 min. Participation costs € 295 per person.

You can register for the webinars online at Rehm Webinar Registration using the registration link for the relevant date.

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