Indium Corporation to host SMT assembly & root cause analysis webinar
As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion Technical Webinars, Indium Corporation’s David Sbiroli, principal engineer, will share how to optimize two of the most important areas of the SMT assembly process—printing and reflow.
To obtain a high yield process with a low defect rate, both the printing and reflow process must be fully understood and fine-tuned to work with the materials being used for assembly. In Best Practices for SMT Assembly & Root Cause Analysis, Sbiroli will discuss:
- Printed circuit board assembly (PCBA) material’s selection and optimization (solder paste and board design)
- Proper storage and handling techniques
- Stencil selection
- Stencil printer setup
- Common solder paste printing defects and how to overcome
- Designing a reflow profile for low voiding and high reliability
- Understanding and mitigation of common reflow-related defects, including voiding, head-in-pillow (HIP), non-wet opens (NWO), graping, and tombstoning
A question-and-answer session will be held at the end of the presentation; bring your SMT process challenges to discuss with the presenter.
This session of Driving e-Mobility: Rel-ion Technical Webinar series is scheduled for Wednesday, Oct. 12 with two opportunities to participate: the first at 8:30 a.m. Germany/12 p.m. India/2:30 p.m. China and Malaysia, and the second at 10 a.m. San Francisco/1 p.m. New York/6 p.m. London/7 p.m. Germany.
The Driving e-Mobility: Rel-ion Technical Webinars series features global industry technical experts in advanced materials and the automotive market, with all sessions moderated by Brian O’Leary, Indium Corporation’s global head of e-Mobility and infrastructure. This series of webinars is intended specifically for those involved in the field of e-Mobility, whether new to the industry or with several years of experience, as the EV industry undergoes rapid growth and evolution.
Sbiroli is a Principal Engineer at Indium Corporation. In this role, he characterises soldering materials critical performance attributes and assists in the development of new materials and the accelerated test methods to augment critical performance. He is also the Technical Manager of Global Accounts. As such, he is responsible for the coordination, business maintenance, and resource deployment of technical services and onsite support to Indium Corporation’s global customer base with a focus on key automotive customers. David joined Indium Corporation in 1993. He has more than 25 years of hands-on experience in the selection and applications of printed circuit board assembly materials and SMT process optimisation, defect reduction, and troubleshooting on hundreds of Indium Corporation customers’ SMT and electronic assembly production lines. He has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He achieved one of the highest scores on the SMTA Process Engineer certification exam and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. Sbiroli actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards.
O’Leary is responsible for promoting Indium Corporation’s full range of products and services for e-Mobility, which include electric cars, trucks, and charging stations. He has more than 20 years of experience in sales, marketing, and channel management in the electronics industry. He currently serves as the chair of the IPC EV (Electric Vehicle) Quality & Reliability Advisory Group. In addition to regular technical conference participation, Brian co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.