A recent webinar, hosted by Paige Hookway, Managing Editor of Electronic Specifier, in collaboration with Molex and Avnet Abacus, centred on The Power of Innovation: Advanced High-Power Connectivity in Next Gen Applications.
The session’s main speaker, Reuben Irizarry, Global Product Manager for High-Power Connectivity at Molex, set the stage by outlining market trends – characterised by the demand for delivering more power in ever smaller spaces, and the push towards high current densities and elevated voltages, often exceeding 800 volts.
Irizarry explained that Molex defines ‘high power’ as over 30 amps per circuit, describing how engineers increasingly seek modular, low-profile, and scalable connector solutions. Molex’s offerings reach up to 1,500 volts and 450 amps per circuit, encompassing a broad, configurable portfolio suited to a vast array of applications. He highlighted the company’s system-level approach, providing not just connectors but also cables, bus bars, and cable assemblies – allowing for comprehensive power distribution solutions.
A focal point of the presentation was the Extreme Power family of flat bladed connectors, which includes the LPH (Low Profile Hybrid), 1060, Guardian, Energetic, and Power Mass products. These feature modularity, various current ratings (from 30 to 150A per blade), and are adaptable for board-to-board, wire-to-board, and edge-card uses. Irizarry introduced an online configurator tool that enables customers to customise solutions to their requirements, ensuring quick access to drawings and models for design evaluation.
Beyond flat-bladed systems, Irizarry discussed Molex’s circular contact products, such as the Sentrality pin-and-socket family, which stands out for its low contact height, high current capabilities (up to 350A), and unique designs supporting self-alignment and tolerance management. Other noteworthy lines covered included Powerwise, Powerwise BMI, Sidewise, Ultrawise, and Hypercube – each demonstrating various innovations like positive locking, ultrasonic welding, and miniaturisation to support use in data centres, industrial devices, and automotive sectors.
Irizarry structured much of his commentary through application-driven examples. He described how Molex connectors facilitate power distribution in data centres (including the Open Compute Project’s standards and next-generation GPU/AI racks), energy storage, electric vehicles, and industrial automation. Special attention was given to solutions addressing thermal management, such as the development of liquid-cooled bus bars that mitigate heat generation from increased currents.
The latter portion of the meeting shifted into an interactive Q&A moderated by Hookway. Audience members asked detailed questions about Molex’s innovations, modularity, differentiation from competitors, and adaptability to emerging market trends like higher voltage DC and hybrid signal-power integration. Irizarry emphasised Molex’s global manufacturing presence, quality standards, engineering support, and highly customisable ‘Lego-style’ assembly methodologies, which minimise tooling investments and shortens timelines for bespoke solutions.
