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Thermoelectric material has high power factors
Bluetooth SiP with smallest footprint for IoT
Bluetooth 4.2 module reduces EIoT design burdens

Bluetooth SiP with smallest footprint for IoT

With a mere 6.5×6.5mm package, the BGM12x is the smallest footprint Bluetooth module with built-in antenna, oscillators and passive components so you can start miniaturising Bluetooth enabled designs without sacrificing performance.
15 November 2016
byNews Desk

15 November 2016
byNews Desk

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Thermoelectric material has high power factors

15 November 2016
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Bluetooth 4.2 module reduces EIoT design burdens

15 November 2016

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