The company’s Reflow Oven product line consists of compact benchtop reflow ovens to higher volume production models. The video details the many unique features of the company’s Reflow Oven product line. Also illustrated is the company’s patented Horizontal Convection ™ technology, which enables APS Novastar’s Reflow Ovens to provide accurate, consistent, and reliable thermal profiles for exceptional reflow soldering results. The Horizontal Convection technology, which creates a cyclone of air circulated around the printed circuit board, provides improved thermal penetration across the board and yields better results with tough-to-solder components such as BGAs and J-leaded quad flat packs.
Reflow Oven Video Released for Surface Mount Printed Circuit Board Assembly from APS Novastar.
APS Novastar is pleased to announce the release of its new video providing an overview of its Reflow Oven products for lead-free and lead based reflow soldering , curing, and thermal cycling applications.