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Stamped Spring Pin Socket for Hittite's HMC7271
Multi-Chip Module Assembly In ADS2012
TI's Smart Meter Board 3.0 Demonstration

Multi-Chip Module Assembly In ADS2012

Jack Sifri of Agilent Technologies demonstrates multi-chip module assembly in Agilent EEsof’s Advanced Design System Software.
13 June 2013
byNews Desk

https://www.youtube.com/watch?v=p7uNpRWTTRw

13 June 2013
byNews Desk

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Stamped Spring Pin Socket for Hittite's HMC7271

13 June 2013
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TI's Smart Meter Board 3.0 Demonstration

13 June 2013

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