News & Analysis news from Electronic Specifier

Popular Searches

Trending Now

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

6 March 2026

DigiKey collaborates with STMicroelectronics and Ultra Librarian

DigiKey collaborates with STMicroelectronics and Ultra Librarian

DigiKey collaborates with STMicroelectronics and Ultra Librarian

23 March 2026

Where there’s smoke, there are ASICs

Where there’s smoke, there are ASICs

Where there’s smoke, there are ASICs

Power

23 March 2026

Power Integrations extends flyback topology to enable 440W

Power Integrations extends flyback topology to enable 440W

Power Integrations extends flyback topology to enable 440W

Power

23 March 2026

What are You Looking For?

Popular Searches

Trending Now

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

IO-Link: making the connection from sensor to Edge computing

6 March 2026

DigiKey collaborates with STMicroelectronics and Ultra Librarian

DigiKey collaborates with STMicroelectronics and Ultra Librarian

DigiKey collaborates with STMicroelectronics and Ultra Librarian

23 March 2026

Where there’s smoke, there are ASICs

Where there’s smoke, there are ASICs

Where there’s smoke, there are ASICs

Power

23 March 2026

Power Integrations extends flyback topology to enable 440W

Power Integrations extends flyback topology to enable 440W

Power Integrations extends flyback topology to enable 440W

Power

23 March 2026

Home News & Analysis Page 16

PCIM Asia New Delhi Conference proves to be a rousing success

PCIM Asia New Delhi Conference proves to be a rousing success

First-ever PCIM Asia New Delhi Conference proves to be a rousing success in 2025

Events News

13 December 2025

Imec, the Leuven-based semiconductor research hub, has unveiled a new method for producing compact and comparatively low-cost short-wave infrared sensors, a development it says could widen the use of the technology across sectors from security to agriculture and automotive.

Imec, the Leuven-based semiconductor research hub, has unveiled a new method for producing compact and comparatively low-cost short-wave infrared sensors, a development it says could widen the use of the technology across sectors from security to agriculture and automotive.

Imec unveils scalable quantum dot SWIR sensor platform on 300 mm CMOS wafers

Latest

12 December 2025

It is important to consider obsolescence management in the design process.

It is important to consider obsolescence management in the design process.

Obsolescence management starts with design

12 December 2025

YWE 2025 winners announced

YWE 2025 winners announced

YWE 2025 winners announced

12 December 2025

EIB & ST: €1Bn agreement to boost Europe’s competitiveness and strategic autonomy

EIB & ST: €1Bn agreement to boost Europe’s competitiveness and strategic autonomy

EIB & ST: €1Bn agreement to boost Europe’s competitiveness and strategic autonomy

News & Analysis

12 December 2025

How will the European Union AI Act impact you?

12 December 2025

Synopsys to showcase future of automotive engineering

Synopsys to showcase future of automotive engineering

Synopsys to showcase future of automotive engineering at CES 2026

12 December 2025

MOSTLY AI: protecting privacy with synthetic data

MOSTLY AI: protecting privacy with synthetic data

MOSTLY AI: protecting privacy with synthetic data

12 December 2025

Who is Jensen Huang, Financial Times’ Person of the Year 2025?

Who is Jensen Huang, Financial Times’ Person of the Year 2025?

Who is Jensen Huang, Financial Times’ Person of the Year 2025?

News & Analysis

12 December 2025

byPaige Hookway

xMEMS Labs will use CES 2026 to unveil a pair of silicon-based audio and cooling technologies that it says will underpin a new generation of thinner, lighter AI-enabled consumer devices, as the sector shifts towards what it calls “Physical AI”.

xMEMS Labs will use CES 2026 to unveil a pair of silicon-based audio and cooling technologies that it says will underpin a new generation of thinner, lighter AI-enabled consumer devices, as the sector shifts towards what it calls “Physical AI”.

xMEMS to unveil solid-state audio and cooling technologies aimed at next-generation AI wearables at CES

11 December 2025

Real-Time Innovations plans to unveil the latest version of its software-defined vehicle platform at CES 2026, as competition intensifies around tools that promise to accelerate development of next-generation automotive systems.

Real-Time Innovations plans to unveil the latest version of its software-defined vehicle platform at CES 2026, as competition intensifies around tools that promise to accelerate development of next-generation automotive systems.

RTI to debut AI-enhanced software defined vehicle platform at CES 2026

Events News

11 December 2025

Who is TIME Magazine’s 2025 Person of the Year?

11 December 2025

byPaige Hookway

p-type FET progress with monolayer WSe₂ unveiled at IEDM 2025

p-type FET progress with monolayer WSe₂ unveiled at IEDM 2025

p-type FET progress with monolayer WSe₂ unveiled at IEDM 2025

Events News

11 December 2025

ByteSnap Design, the Birmingham-based embedded systems specialist, has published a new guide distilling lessons from more than £500,000 of automotive development work, as demand grows for practical approaches to safety-critical software compliance.

ByteSnap Design, the Birmingham-based embedded systems specialist, has published a new guide distilling lessons from more than £500,000 of automotive development work, as demand grows for practical approaches to safety-critical software compliance.

ByteSnap distils £500k of automotive software lessons into new MISRA C guide

11 December 2025

Google DeepMind to open Gemini-integrated research lab in UK

Google DeepMind to open Gemini-integrated research lab in UK

Google DeepMind to open Gemini-integrated research lab in UK

11 December 2025

byPaige Hookway

Altus reports demand for guidance on convection reflow oven

Altus reports demand for guidance on convection reflow oven

Altus reports demand for guidance on convection reflow oven

News & Analysis

11 December 2025

nVent SCHROFF solutions sharpen focus for 2026

Latest

11 December 2025

byPaige Hookway

AMD EPYC Embedded 2005 Series processors

AMD EPYC Embedded 2005 Series processors

AMD EPYC Embedded 2005 Series processors

Latest

10 December 2025

Highest-growth markets for UK tech in 2026 predicted

Highest-growth markets for UK tech in 2026 predicted

Highest-growth markets for UK tech in 2026 predicted

Analysis

10 December 2025

CEA-Leti and STMicroelectronics used this year’s International Electron Devices Meeting in San Francisco on 9th December to outline a manufacturing route that could push radio-frequency and optical front-end modules towards full monolithic integration on silicon.

CEA-Leti and STMicroelectronics used this year’s International Electron Devices Meeting in San Francisco on 9th December to outline a manufacturing route that could push radio-frequency and optical front-end modules towards full monolithic integration on silicon.

CEA-Leti and STMicroelectronics unveil monolithic silicon route for next-generation RF front ends at IEDM

News & Analysis

10 December 2025