News & Analysis

PMC-Sierra introduces Universal Front End 4 (UFE4) silicon to accelerate transition of carrier networks to Ethernet-based mobile backhaul

• Analysis

14 February 2011

byNews Desk

Maxim creates new Power SoC product category to reduce PCB size, extend battery life, and lower total system cost of mobile devices

• Analysis

14 February 2011

byNews Desk

Cambridge Consultants to support ip.access in new product development

• Analysis

14 February 2011

byNews Desk

ARM Processor Technology and ARM Partners Continue to Lead in Wireless Connectivity with the Transition to LTE and LTE-Advanced Markets

• Analysis

14 February 2011

byNews Desk

Analox Chooses LDRA for IEC 61508 Compliance

• Analysis

14 February 2011

byNews Desk

Imec reports reconfigurable radio solutions enabling low-cost and low-power spectrum sensing

• Analysis

14 February 2011

byNews Desk

Broadcom’s New Combo Chip Integrates 802.11n Wi-Fi, Bluetooth 4.0 + HS and FM to Bring New Multimedia Applications to Smartphones, Tablets and Other Mobile Devices

• Analysis

14 February 2011

byNews Desk

Gary Meyers Named to Oasys Design Systems’ Board of Directors

• Analysis

14 February 2011

byNews Desk

Atmel Digital Temperature Sensors

• Tech Videos

12 February 2011

byNews Desk

Integrating AT-MINI bootloader in mikroElektronika AVR compilers

• Tech Videos

11 February 2011

byNews Desk

AirWalk, Mindspeed and Lime Microsystems Collaborate on LTE Small Cell Technology Development

• Analysis

11 February 2011

byNews Desk

NEXCOM Increases Production Capacity by 50% with the Opening of a New Manufacturing Site in Banqiao, Taiwan

• Analysis

11 February 2011

byNews Desk

Agilent Technologies Completes Acquisition of A2 Technologies’ Assets

• Analysis

11 February 2011

byNews Desk

Agilent Technologies to Demonstrate Industry-First Design and Test Solutions for 3G/4G and LTE-Advanced at Mobile World Congress

• Analysis

11 February 2011

byNews Desk

STMicroelectronics and bTendo to Develop Focus-Free Embedded Pico-Projector for Next-Generation Smart Phones

• Analysis

11 February 2011

byNews Desk

STMicroelectronics Leading the Charge for Sensing New User Interfaces at Mobile World Congress

• Analysis

11 February 2011

byNews Desk

STMicroelectronics’ IPAD Technology Shrinks and Simplifies Protection for High-Bandwidth Connections

• Analysis

11 February 2011

byNews Desk

China Telecom and Huawei Deploy World’s First iODN FOA Site

• Analysis

11 February 2011

byNews Desk

Oberthur and NXP Announce Licensing Agreement for MIFARE on SIM Cards

• Analysis

11 February 2011

byNews Desk

X2O Media’s vClips and Xpresenter Xe Video Poster Keep Students, Alumni, and Visitors Engaged and Informed at Le Moyne College

• Analysis

11 February 2011

byNews Desk