Mouser strengthens RF, mixed signal chips offering

30th June 2021

Mick Elliott

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Mouser Electronics has sealed a global distribution agreement with Telink Semiconductor, a manufacturer of low-power radio frequency and mixed signal system chips for Internet of Things (IoT) applications.

According to the agreement, Mouser will offer customers Telink’s range of system-on-chips (SoCs), starter kits, and multi-protocol IoT solutions.

The Telink TRS827x series offers ultra-low power, concurrent, multi-protocol IoT solutions at the ISM 2.4GHZ band.

The devices support Bluetooth Low Energy 5.1, Bluetooth SIG Mesh, Zigbee, HomeKit, RF4CE, and 2.4 GHz proprietary protocols.

Built on a 32-bit RISC-based microcontroller, the devices are capable of running up to 48MHz and feature up to 32 general-purpose inputs/outputs (GPIOs), including a 14-bit analog-to-digital converter (ADC), I²C, SPI, I²S, and stereo audio output.

The TRS8278 Audio RCU Starter Kit features a button function and voice command function support, making it a suitable choice for RF and IR remote control applications.

It offers Google voice service, and it boasts 27 valid buttons and two-colour indicating LEDs.

The TLSR825x series multi-protocol IoT solutions are single-chip devices suitable for IoT and human interface device (HID) applications. The low-power, concurrent solutions support Bluetooth Low Energy 5.0 with support for up to eight antennas for indoor positioning in addition to standard Bluetooth 5.0 features.

Designers can use the TLSR825X devices in a wide range of applications, including wearable devices, wireless toys, advanced remote controls, smart lighting, and smart home products.

Telink’s Kite Mesh Starter Kit, based on the TLSR8258 device, features multiple PCBAs to implement Bluetooth Mesh applications.