Mouser-backed DS PENSKE Formula E team earns podium finish

Mouser-backed DS PENSKE Formula E team earns podium finish Mouser-backed DS PENSKE Formula E team earns podium finish

Mouser Electronics congratulates Jean-Éric Vergne and the DS PENSKE Formula E racing team after Vergne claimed third place in round 14 of the ABB FIA Formula E World Championship at the Tempelhof airport track in Berlin, Germany.

Coming off a position 18 start, Vergne focused on power management and strategic moves to climb through the competition and cross the line in third, scoring valuable points for the team and a spot on the podium. The previous day saw Maximilian Günther finish sixth in round 13, scoring eight points for the team.

“Congratulations to the entire DS PENSKE Racing team on their incredible performance and winning strategy this weekend,” said Todd McAtee, Senior Vice President, Business Development for Mouser Electronics. “The Berlin track offers quite a few challenges, and the team certainly shined.”

Mouser is supporting the DS PENSKE team for the globe-trekking 2024/2025 season in collaboration with TTI, Inc., and valued manufacturers Molex and KYOCERA AVX. Mouser and Molex have been partnering to sponsor Formula E racing since 2015.

Formula E cars are powered solely by electricity and represent a vision for the future of the motorsports industry, serving as a framework for research and development around zero-emission motoring. Racing is all about speed and endurance, and racing partnerships are an innovative way for Mouser to communicate its performance-driven business model and promote the newest technologies from its manufacturer partners.

To learn more about the Mouser-backed DS PENSKE Formula E team and view the ABB FIA Formula E World Championship Racing Season 11 schedule, visit https://eu.mouser.com/formula-e/

Keep Up to Date with the Most Important News

By pressing the Subscribe button, you confirm that you have read and are agreeing to our Privacy Policy and Terms of Use
Previous Post
binder addresses a trend with M12 power connectors

binder addresses a trend with M12 power connectors

Next Post
Infineon’s CoolSiC MOSFETs 1200V G2 in a Q-DPAK package

Infineon’s CoolSiC MOSFETs 1200V G2 in a Q-DPAK package