Siemens receives 32021 TSMC awards for next-gen design enablement
Siemens Digital Industries Software has announced it has been recognised by TSMC as a recipient of three 2021 OIP Partner of the Year awards.
These prestigious awards honour TSMC Open Innovation Platform (OIP) ecosystem partners like Siemens for demonstrating excellence in next-generation system-on-chip (SoC) and 3DIC design enablement over the past year.
For this year’s achievements, TSMC recognised Siemens in the categories of 'Joint Development of 4nm Design Infrastructure' for the optimisation of Siemens’ Calibre nmPlatform software and analogue FastSPICE platform, 'Joint Development of Cloud-Based Productivity Solution' for Siemens’ Calibre nmDRC solution and 'Joint Development of 3DFabric Design Solutions' for collaboration on Siemens’ Xpedition Substrate Integrator, Xpedition Package Designer, HYPERLYNX, Calibre 3DStack/nmDRC/nmLVS/xACT and Tessent solutions.
“Congratulations to Siemens Digital Industries Software as the winner of three 2021 TSMC OIP Partner of the Year awards,” said Suk Lee, Vice President of Design Infrastructure Management Division at TSMC.
“Our OIP ecosystem partners’ continuous collaboration helps us remain at the forefront of technology development, while enabling our customers to fully leverage the significant power, performance, and area benefits of TSMC’s advanced technologies.”
The title of OIP Partner of the Year is awarded to partner companies working relentlessly to achieve the highest standards of design development and technology implementation. Siemens will continue working with TSMC to enable next-gen designs with certified solutions and services for TSMC’s latest technologies.
“Siemens is pleased and honoured that our long history of collaboration with TSMC continues with these 2021 OIP Partner of the Year recognitions,” said Michael Buehler-Garcia, Vice President of Product Management for Calibre Design Solutions at Siemens Digital Industries Software.
“TSMC and Siemens are delivering solutions that address not only the complexities of advanced semiconductor process, but our joint collaboration on Cloud use models and 3DIC design flows also helps to give mutual customers choices in how they choose to bring these increasingly sophisticated designs to life.”