congatec launched its first COM-HPC Mini Computer-on-Module (COM) powered by the Qualcomm Dragonwing IQ-X Series processors. The new conga-HPC/mIQ-X with the Qualcomm Oryon CPU delivers exceptional single and multithread compute performance – previously achieved only with x86 based-designs – at best-in-class power efficiency.
Edge AI applications, including local machine learning (ML) and the running of large language models (LLMs), benefit from up to 45 TOPS of AI performance with the dedicated NPU powered by the Qualcomm Hexagon processor. The conga-HPC/mIQ-X addresses the growing demand for high-performance, energy-efficient compute platforms in markets such as security, transactional retail, robotics, medical technology, and industrial automation.
Robust, compact, and AI-optimised
With a form factor roughly the size of a credit card, the conga-HPC/mIQ-X features a robust design with soldered, fast LPDDR5X RAM and support for an industrial temperature range from -40°C to +85°C.
Typical use cases include video surveillance, sensor, and camera systems for Edge analytics and applications with local AI processing. This platform is ideal for developers who want to leverage the strengths of Arm on Microsoft Windows. It reduces development time compared to other implementations through simplified software integration and UEFI-compatible firmware. All size, weight, and power (SWaP) optimised designs also benefit from the high performance per watt of the new mini modules.
“The conga-HPC/mIQ-X takes embedded Arm computing to a new level of performance and simplifies the development of AI-accelerated edge and vision systems through UEFI BIOS support, Windows integration, and a complete ecosystem,” explains Konrad Garhammer, COO and CTO of congatec.
Feature set in detail
The conga-HPC/mIQ-X COM-HPC Mini module – measuring 95 x 70mm – is based on Qualcomm Dragonwing IQ-X Series processors with up to 64GB of LPDDR5X memory. With up to 12 Oryon cores, a dedicated Hexagon NPU, DSP, and Qualcomm Spectra ISP, it offers optimised computing units for ultra-efficient processing of video, image, and audio data. The integrated Qualcomm Adreno GPU delivers powerful graphics, supporting up to three displays and 8K resolution. For fast networking and peripheral connectivity, the COM-HPC Mini module offers 2x 2.5Gb Ethernet, up to 16x PCIe Gen3/Gen4 lanes, 2x USB4, 2x USB3.2 Gen2x1, and 8x USB2.0. Graphics output is via 2x DDI and eDP, and up to four cameras can be connected directly via MIPI CSI. 2x I2C, 2x UART, and 12x GPIO round out the feature set. The integrated TPM 2.0 module serves as the hardware root of trust.
Short time-to-market thanks to aReady.COM
To accelerate time-to-market, congatec offers optimised cooling solutions, evaluation boards, and comprehensive design support. The new COM-HPC Mini module is also available as an application-ready aReady.COM. It is delivered customised with validated and pre-installed operating systems and optional software building blocks for IoT functionality, faster development, and optimised cost.
