Altus Group, distributor of electronics production equipment in the UK and Ireland, has begun offering Heller Industries’ Short-Cycle Vacuum Reflow Oven (SCVR), aiming to meet growing demand for high-volume vacuum soldering in the region.
Vacuum reflow soldering, which removes voids in solder joints and improves reliability in complex electronics, has traditionally been constrained by slow cycle times, limiting its adoption in high-volume production. Heller’s SCVR addresses this bottleneck with a patented multi-stage conveyor system that reduces the time boards spend entering and exiting the vacuum chamber, effectively doubling units per hour without compromising joint quality.
Joe Booth, Chief Executive of Altus Group, said the system “makes high-volume, high-reliability production more practical than ever before, giving engineers confidence they can meet demanding process requirements without sacrificing throughput or quality.”
The SCVR integrates three infrared heating panels within its vacuum chamber to optimise solder paste profiles, and offers real-time temperature control with ±0.5°C accuracy at the PCB level. It also includes Heller’s HELLER365 platform for process monitoring and Industry 4.0 integration, enabling manufacturers to track temperature curves, vacuum pressure, and board-level data in real time.
Designed for sectors where void-free soldering is critical, the oven targets automotive power modules, RF components for telecommunications, Mini/Micro LED assembly, and high-density interconnect applications. Its modular, open-architecture design facilitates upgrades, maintenance, and cleaning, which manufacturers say is essential for sustained uptime.
Altus Group, which was established in 2001 to supply surface-mount technology and related capital equipment across the UK and Ireland, said the introduction of the SCVR reinforces its commitment to supporting manufacturers with solutions that balance productivity and reliability.
