Due to changes in the operating conditions of electronic assemblies, new mission profiles are constantly needed to ensure lifetime reliability. For example, today’s existing test duration has increased from 168 hours to 1,000 hours (+600%). These changes also increase the demands on the materials used in assemblies. In the area of no-clean solder pastes, there is enhanced focus on the surface insulation resistance (SIR) test as proof of the electrochemical duration reliability of these flux residues. Some flux systems in solder already have solutions to these new challenges. Indium Corporation has the solution for increased reliability requirements, tested and adopted by many leading automotive and EV manufacturers. Indium Corporation’s Rel-ion suite of products for e-Mobility are reliable, scalable, and proven materials, which offer superior electrical, mechanical, and thermal reliability.
Hu joined Indium Corporation in 2016 and is based in Suzhou, China. He has more than 15 years of experience in semiconductor packaging and is a veteran in advanced assembly technology development, process improvement, and assembly materials applications. Hu has served in many roles at industry-leading outsourced assembly and test (OSAT) companies, including process engineer, project engineer, senior R&D engineer, and chief engineer. He has a master’s degree in IC engineering from the Chinese Academy of Science, and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.
