YINCAE announces the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging, image sensors, AR/VR modules, and advanced flip-chip assemblies where optical clarity, thermal endurance, and reliability are critical.
Technical performance highlights:
- Thermal endurance: Withstands 5× 260°C reflow cycles without cracking, delamination, or adhesion loss.
- Optical transparency: Maintains >95% light transmittance (400–800nm), ensuring minimal signal loss through optical pathways.
- Non-yellowing stability: Exceptional resistance to discoloration after repeated high-temperature exposure.
- Reliability: Excellent adhesion to silicon, glass, and substrate materials for enhanced package durability.
- Mechanical properties: Controlled modulus formulation reinforces delicate structures while minimising stress and warpage.
UF 66L overcomes the limitations of conventional epoxy underfills, which often lose transparency or degrade under thermal cycling. It is specifically optimised for optical interconnect stability, waveguide coupling, photodetectors, and high-density optoelectronic packaging, enabling reliable performance in next-generation devices.
“UF 66L provides engineers with a robust, optically clear underfill that maintains mechanical integrity and optical performance under demanding processing and operational conditions,” said CTO at YINCAE.
