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What's next for automotive electronics at electronica 2018?

10th September 2018
Lanna Cooper

At this year's electronica show in Germany, Texas Instruments will reveal how it is 'designing tomorrow' for the automotive and industrial markets through advancements in analogue and embedded processing Integrated Circuits. TI will showcase technology for the future of smart driving, smart buildings and smart factories with interactive demonstrations and presentations. Visitors will have the chance to sit down with engineering experts to learn about the company’s latest innovations.

Smart driving
Automobile designers want technologies that maximise the driving distance per charge, improve vehicle perception and driver visibility, and enhance passenger comfort and convenience.

Attendees will interact with the latest automotive innovations at electronica, where TI will present advancements for vehicle electrification, the digital cockpit, the connected car, autonomous driving technology and more.

The demonstration will highlight innovation for off- and on-board charging of Electric Vehicles (EVs), lighting, interior body sensors, and Advanced Driver-Assistance Systems (ADAS).

Smart buildings
Companies continue to add more electronics to building designs to make them smarter, safer, more efficient and more connected. Attendees will experience the latest building automation innovations at electronica, where TI will show how companies can incorporate intelligent detection, using next-gen sensing capabilities and connectivity technology that supports multiple wireless protocols, including Bluetooth, Thread, Zigbee, WiFi and more.

Smart factories
As Industrial IoT becomes prevalent in factory designs, manufacturers need smarter technologies to help predict, detect and transmit data to the cloud and from machine to machine.

In TI’s Industry 4.0 demonstration area, visitors will be able to see what’s next in industrial automation, robotics, predictive maintenance, machine vision and more.

Visit the TI booth to try out new products and fully tested reference designs, including real time Time-Sensitive Network (TSN) technology, TI mmWave sensing and IO-Link communication.

Powering, controlling, sensing, connecting and more...
Attendees will be able to take part in an engineer-to-engineer experience with TI experts at four technology workbenches, featuring power management, sensors, wireless connectivity, MCUs and processors.

For example, TI engineers will showcase GaN technology innovation for power design, ultrasonic sensing, and hands-on demonstrations featuring TI’s SimpleLink MCU products.

Beyond the TI booth at electronica
Visitors can also learn from TI experts in one or all of the following presentations at the show.

Wednesday 14th November:

  • “Industry 4.0 embedded processor platform with integrated time sensitive network (TSN),” by Thomas Leyrer, Applications Manager for Factory Automation Systems.
  • “Multi-protocol wireless communication,” by Ben Gilboa, Low-Power RF System Engineer, and Priya Thanigai, Low-Power RF Marketing Manager.
  • “IoT - Low-power embedded WiFi,” by Uri Weinrib, MCU Applications Engineer.
  • “Sensor-to-Cloud connection made simple with intelligent gateway,” by Sai Reddy, MCU Applications Engineer.
  • “More than just car talk: How automotive technology is scaling to industrial vehicles,” by Prajakta Desai, Product Marketing Manager for Industrial Radar.

Thursday, 15th November:

  • “Implementing a secure OTA update application for wireless MCU devices,” by Nicholas Lethaby, MCU Systems Engineer.
  • Tech Talks session: Industrial IoT panel with Miro Adzan, General Manager for TI’s Factory Automation Systems.

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