ATP will showcase these solutions and related products from 16th to 18th November at booth #C-30-3 at Embedded Technology 2016 in Yokohama, Japan.
3D MLC/TLC NAND is primarily characterised for usage in big market SSD usage models in client and enterprise applications. 3D NAND utilisation in embedded, industrial applications must be particularly characterised for many other conditions including data retention over temperature variance, cross temperature reliability, and read-only boot usage models among others. To be at the forefront of this technology shift, ATP has taken the initiative with major resource investment into characterisation of 3D NAND in such conditions.
