Ultra-low-power Edge AI and Wi-Fi SoCs for next-gen smart devices

Ultra-low-power Edge AI and Wi-Fi SoCs for next-gen smart devices Ultra-low-power Edge AI and Wi-Fi SoCs for next-gen smart devices

RiseLink has announced a series of activities at CES 2026, highlighting how its Edge AI and connectivity technologies are enabling scalable, production-ready smart devices.

At CES 2026, RiseLink CEO Dr. Pengfei Zhang will participate in an official CES Smart Home panel, ‘The Latest in Smart Devices and Smart Home Integration,’ alongside leaders from Amazon, Bosch, Ecobee, and EY.

“RiseLink focuses on enabling Edge AI through ultra-low-power, cost-effective system-on-chips that allow smart devices to scale reliably from prototype to production,” said Dr. Pengfei Zhang. “As AI moves onto devices, efficiency and integration become just as important as model capability.”

In addition, ChooChoo, an AI-powered interactive reading toy built on RiseLink’s ultra-low-power Wi-Fi and Edge-AI chips, has been selected for broadcast as part of the official CES programming, demonstrating conversational AI running efficiently on-device in a production-ready consumer product.

“ChooChoo brings research-driven interaction to life on the Edge,” said Dr. Diana Zhu, Head of US at RiseLink and creator of ChooChoo. ChooChoo will be demoed live at the RiseLink booth (Venetian Expo Hall A–D, Booth 53117).

RiseLink will host ‘The Blueprint for Physical AI: AI-Native Hardware Mixer @ CES 2026,’ an invitation-only gathering for founders, product leaders, chipmakers, and system architects building AI-native smart devices. The mixer takes place in Las Vegas on Thursday, 8th January 2026 (6:00–9:00pm) and will feature focused networking and discussions on scaling Edge AI from chip to production-ready devices. Attendance is limited; registration is available at https://luma.com/9igbskoz.

RiseLink will exhibit at CES 2026, Venetian Expo Hall A–D, Booth 53117, showcasing its latest Wi-Fi MCU and AIoT platforms designed for strong RF performance, deep system integration, and industry-leading ultra-low-power operation across smart home devices, AI-enabled consumer products, and emerging intelligent applications.

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