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Texas Instruments at embedded world: Advancing intelligence and electrification

28th February 2023
Harry Fowle
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Texas Instruments (TI) will showcase technologies that are “Advancing Intelligence and Electrification” at embedded world 2023, 14th-16th March in Nuremberg, Germany. TI experts will demonstrate embedded processing and electrification innovations including new Arm Cortex-based microcontrollers (MCUs) and processors, as well as other embedded technologies in applications for advanced driver assistance systems (ADAS), robotics and renewable energy. Visit TI in Nuremberg Messe, Hall 3A, Booth 215.

TI will demonstrate innovative embedded processing products, reference designs and engineering expertise at the embedded world conference.

Demonstrations will focus on these areas:

  • Scalable, general-purpose processing: TI will showcase a new scalable MCU portfolio with pinout options to meet memory and analogue integration design requirements in almost any application. Demonstrations for this portfolio include a chamberless smoke detector and medical applications such as a blood pressure monitor and pulse oximeter that leverage these MCUs to reduce cost and system size.
  • AI cameras for automated grab-and-go retail: TI will demonstrate a new processor portfolio that enables seamless retail transactions where customers can shop and pay for items automatically. These processors enable accurate and quick object detection through vision processing deep learning algorithms.
  • Vehicle electrification: The TI battery management system (BMS) reference board will showcase the company’s comprehensive BMS portfolio, including multiple devices for accurate battery monitoring and high-precision current and voltage sensing, in addition to connectivity, solid-state relay, isolated power devices and more. TI will demonstrate a complete hardware and software BMS solution, interfacing with a Comemso hardware-in-the-loop simulator to feature a self-contained system mimicking a real battery pack.
  • Driver assistance: ADAS domain controller applications use a diversity of sensor inputs to build a picture of the environment around the vehicle. These systems may use as many as 11 cameras of differing resolutions and fields of view, combined with five radar sensors as inputs to a perception system in an L2 or L3 driving system. This demonstration shows how TI’s AI-enabled processor, the TDA4VH-Q1, easily handles 12 cameras (each at a 2-MP resolution) and performs image pre-processing on all inputs simultaneously in real-time, using only the image accelerators on the chip. This pre-processing allows the application and signal-processing cores to run the computer vision and AI algorithms required for accurate perception.
  • Edge AI-enabled industrial robots: TI will show a collaborative robot arm that demonstrates how it can safely and intelligently interact with human gestures, using a TI millimetre-wave radar sensor and TDA4VM processor to enable faster, safer and cost-effective robots. Such a solution accelerates the development of sensor fusion with vision and radar sensors, helping with the design of energy-efficient, affordable and functionally safe International Organisation for Standardisation (ISO) 10218-compliant robots for harsh industrial environments.
  • Renewable energy: TI will show a battery energy storage system using a precision battery monitor and balancer, voltage and current sensor, and isolated switch driver. This system enables highly accurate monitoring of multimodule battery cells that can provide precise battery cell voltage, temperature and rack current, increasing the accuracy of state-of-charge and state-of-health estimations and system reliability.

TI will add videos of these demonstrations and more to its embedded world website 10th March.

Presentations

TI speaking sessions at embedded world include:

  • “Using Standard TSN Ethernet Features to Improve Timing in the Controller of an Industrial Ethernet Protocol,” presented by Pekka Varis, Senior Member Technical Staff, 14th March at NCC Ost.
  • “Advantages of MIPI I3C Enabling Simpler Designs in a Variety of End-Equipment Applications,” presented by Saminah Chaudhry, systems manager, Isolation Products, 14th March at NCC Ost.
  • “Partitioning Functional Safety Requirements in an mmWave Radar Sensor System,” presented by Peter Aberl, embedded processing field application engineer, Automotive Central Europe Sales and Marketing, 15th March at NCC Ost.
  • “Challenges and Solutions for Wireless Audio Streaming in Embedded Systems,” presented by Clement Chaduc, 2.4-GHz connectivity software applications lead, 15th March at NCC Ost.
  • “Optimised Security Development Flow with Field-Securable Processors,” presented by Ron Birkett, software product manager, General Purpose Processors; and Robert Finger, principle field application engineer, Processing, 16th March at NCC Ost.
  • “Top 3 Safety Considerations for Industrial and Automotive Systems,” presented by Sean Murphy, marketing lead, Sitara™ Microcontrollers AM26 Products, 16th March in the Exhibitor’s Forum Hall 3.

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