Plasma treatment has long been recognised as a valuable process in the microelectronics and semiconductor packaging industries. The introduction of an appropriate plasma process prior to wire bonding will always deliver a cleaner surface to bond to. Potential benefits are improved wire bond statistics, improved device reliability, and the elimination of excursions caused by non-systemic influences such as random pollution of the surfaces to be bonded by uncontrolled factors.
“Plasma has something of the aura of ‘alchemy’ or a ‘black box’,” explained John Maguire, Business Manager Europe, Nordson MARCH. “There are, nonetheless, realistic expectations about what plasma can contribute both to the performance of a wire bonding process and to the long-term reliability of the packaged device. The benefits of plasma are two-fold: improving the wire bonding process itself and ensuring the long-term reliability of the device. SMT Nuremberg attendees are invited to meet with me at the DAGE Deutschland stand 6-314 for a free consultation on how the quality and success of their manufacturing process and products can be enhanced greatly by plasma cleaning prior to wire bonding.”
