TANAKA Precious Metals to exhibit at PCIM Europe 2023

TANAKA will participate in this exhibition for the first time and will exhibit power devices (power semiconductors) and power device assembly-related components on panels. The main exhibited products will be bonding products such as Al wires and ribbons and Cu wires and ribbons, which are metals that electrically connect semiconductor chips and external electrodes.

Additional products include active metal brazing material/copper composite, which can be applied to ceramic circuit boards for power devices and heat dissipation components such as heat sinks. In the power device field, there is a demand for higher output and higher efficiency. In addition to high heat dissipation, high heat resistance, and high bonding reliability for each component, urgent development is needed for materials that can be further miniaturised.

By taking advantage of the precious metal technology it has cultivated over many years, TANAKA Precious Metals Group will continue to contribute to further technological innovation and meet a wide variety of needs in the power device and power device assembly fields, which are expected to become even more sophisticated in the future.