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Super Dry features Oxidation Free Alternative To Component And PCB Baking At IPC APEX

11th January 2013
Nat Bowers

Super Dry will feature their award winning oxidation free component and PCB drying technology at booth #504 during February’s IPC APEX Exhibition in San Diego. The process will be highlighted there in the Super Dry XSD 701 desiccant dry cabinet. Designed to exceed the formidable challenges associated with IPC J-STD-033C and 1601 for handling Moisture Sensitive Devices, XSD desiccant cabinets deliver a process combining ultra low humidity (<0.5%) and mild temperatures (40-60C) proven to replace traditional oven baking of components and boards at a fraction of the cost.

Unlike other desiccant cabinets with heaters, the Super Dry XSD cabinets can dry BGAs, PCBs and other moisture sensitive devices at oven-equivalent speeds without oxidation and inter-metallic growth induced by traditional baking temperatures. Oxidation is a significant drawback of baking components and even a single bake cycle at typical 125o will significantly increase wetting time. Unlike vacuum or baking ovens, the XSD cabinets also offer cost effective unlimited MSD safe storage in full compliance with 033C specifications.

Super Dry Director Richard Heimsch explained: “We’re pleased to see the growing awareness of Super Dry’s unique technology in the Americas. The newest designs provide not only deliver <0.5% RH levels but also four minute recovery times. This is significant for several reasons, but simply put, these new systems not only safely store, but reset the clock for MSDs without the harmful solderabilty effects caused by conventional baking.”

Managing Director Jos Brehler went on to explain, “These are not only solutions for a new electronics process problem, but they are also cost efficient and extremely eco-friendly. They consume less than 10% of the energy of traditional baking ovens while at the same time reducing overall floor space and logistics.”

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