StratEdge to display LPA packages at two events

These packages play an essential role in transmitting signals from commercial and government satellites and other long-range communications equipment. Engineered for compound semiconductor devices such as GaN and GaAs, the LPA-series delivers ultra-low electrical loss from DC to beyond 31 GHz while efficiently pulling heat away from the die, ensuring maximum reliability for demanding RF and microwave systems.

"Our LPA-series gives designers a proven path to higher reliability and better signal integrity when the margins are extremely thin," said Casey Krawiec, VP of Sales, StratEdge. "Whether you're launching a payload into orbit or building a next-generation ground station, StratEdge packages provide the solid foundation compound semiconductor devices need to reach their full potential."

StratEdge designs and manufactures a complete line of high-frequency packages and offers a Class 1000 cleanroom, including automated gold-eutectic die attach, wedge and ball bonding, and hermetic sealing. Engineers attending either show are invited to meet with StratEdge technical staff to discuss solutions for their most challenging power and thermal requirements.