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STMicroelectronics showcases smart grid and cellular IoT solution at Enlit Europe Energy Forum

27th November 2023
Kristian McCann

STMicroelectronics is set to exhibit its latest advancements in smart grid and cellular IoT connectivity at Enlit Europe, held from 28-30 November 2023 at Paris Expo Porte de Versailles, France.

During the event, STMicroelectronics will unveil its newly certified smart grid chipset and devices designed for cellular IoT services. This includes the industry-first smart-grid chipset certified according to the PRIME 1.4 Hybrid specification. This specification enables robust and flexible communication through both wired and wireless connections, enhancing network coverage and modularity. The certification of this chipset is a significant step in deploying smart meters and supports new applications in smart-home and smart-city segments by ensuring device and infrastructure interoperability. The chipset includes the ST8500 powerline communication (PLC) System on Chip (SoC), the STLD1 line driver, and the S2-LP ultra-low-power radio transceiver, offering hybrid connectivity options.

The ST8500 SoC platform, widely used in smart metering and industrial applications, now powers the official PRIME Hybrid certification-testing tool by TECNALIA. Additionally, ST has launched a new evaluation kit, the EVLKST8500GH-2, featuring an ST8500 PLC module, S2-LP radio expansion board, and compatible microcontroller board. This kit, available now, is designed to accelerate the development of smart meters and similar systems.

STMicroelectronics is also showcasing the ST87M01 NB-IoT industrial module series at Enlit Europe. Compliant with 3GPP Release 15, these modules connect to cellular IoT networks and are now available in two variants: the ST87M01-1000 NB-IoT module and the ST87M01-1100 with an integrated GNSS receiver for location-aware connectivity. These modules, suitable for a wide range of IoT applications, offer connectivity, ultra-low power consumption, and industrial-grade operation. They are available in a compact 51-pin LGA package, ideal for size-critical applications.

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