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“Solder Reflow Fundamentals” with Fred Dimock at SMTAI 2014

2nd September 2014
Staff Reporter

Fred Dimock, Manager of Process Technology at BTU International, will present a tutorial during SMTA International 2014. The tutorial entitled “Solder Reflow Fundamentals” is scheduled to take place on Sunday 28th September, from 8:30 a.m. – 12 p.m. in Room 50 at the Donald Stephens Convention Center in Rosemont, IL. 

Designed for new SMT engineers/technicians or current ones who want a better understanding of the reflow process, the tutorial will focus on the fundamentals of solder reflow and reflow oven operation. Dimock will discuss recipes vs. profiles, heat transfer and oven control, why profiles are shaped the way they are and how to obtain profiles. Additional topics of discussion will include thermocouple accuracy and mounting, profilers, test vehicles, eutectic vs. lead-free process windows and process repeatability. 

Fred holds an Associate Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). His extensive experience in thermal processing includes positions at Corning, General Electric, and Osram-Sylvania before joining BTU.

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