Events News

Smart Systems Integration 2016 opens Call for Papers

2nd July 2015
Jordan Mulcare
0

The Call for Papers of Smart Systems Integration 2016 is now open. The event, which will take place in Munich, Germany 9th to 10th March 2016, will be once again the key platform for the Smart Systems Integration industry to meet and discuss current issues. Deadline to submit abstracts is 5th October 2015.

The conference committee, led by Prof. Dr. Thomas Gessner, Fraunhofer Institute of Electronic Nanosystems, Chemnitz, Germany, looks forward to receiving submissions in English on the following topics:

A. Applications:

  • A01 Smart mobility
  • A02 Smart health
  • A03 Smart energy
  • A04 Smart society
  • A05 Smart production

B. Hardware/Technologies:

  • B01 Design of smart integrated systems
  • B02 Manufacturing of embedded micro and nano systems
  • B03 Advanced micro and nano technologies
  • B04 New materials for nano structures and devices
  • B05 Smart low cost approaches: Roll-to-Roll technologies and printed functionalities
  • B06 Smart test and reliability of components and systems
  • B07 System integration: 3D integration, interconnect technologies and packaging

C. Software for smart integrated systems:

  • C01 Embedded software
  • C02 Stand-alone application software

The conference addresses innovative smart systems, their manufacturing technologies as well as the international research work on smart technologies and materials. Special attention is paid to integration issues in order to guarantee reliability, safety and security of the systems.

Within the keynote sessions special focus is set on the two main topics Hardware for the Internet of Things and Printed / stretchable and flexible electronics. The Best Paper and Best Poster Award will be also awarded in 2016, each with a prize of €500.

The Call for Papers submission requirements and further information are available online at www.smartsystemsintegration.com/callforpapers.

Product Spotlight

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier