Representatives from chip manufacturing powerhouses such as AMD, Samsung Electronics, and SK hynix will join leading packaging providers and research institutions to present on topics including HPC interconnection technologies, 3D packaging, chiplets, HIR (Heterogeneous Integration Roadmap), Hybrid Bonding, LAB (Laser Assisted Bonding), and supply chain management during two sessions.
A key feature of the Advanced Packaging Summit, after each session one hour will be dedicated to in-depth discussions between speakers and conference attendees about technology, market and business trends and issues.