Events News
SEMI 3D & Systems Summit 2025
10th June 2025
Caitlin Gittins
The SEMI 3D & Systems Summit, running 25-27 June 25-27 in Dresden, will showcase the forefront of technological advancement in semiconductor packaging and integration.
Based on the theme, 'Heterogenous Integration: Bolstering Europe's Resilience', the summit will tackle the latest breakthroughs driving innovation in chiplet architectures, hybrid bonding, photonics, and advanced system-level design. From geopolitical dynamics to chiplet applications and hybrid bonding techniques, attendees will dive deep into the critical role of 3D and heterogeneous integration in strengthening Europe’s semiconductor value chain.
"SEMI Europe looks forward to welcoming global advanced packaging experts to Dresden,” said Laith Altimime, President of SEMI Europe. “With an exceptional speaker lineup and a sold-out exhibition, the Summit will spotlight critical advancements in chiplet technologies, hybrid bonding, and photonics – all essential for enabling next-generation intelligent systems and bolstering Europe’s technological resilience."
This year’s SEMI 3D & Systems Summit will present a broad scope of topics, including:
- Geopolitical Dynamics and Market Trends in a Global Semiconductor Landscape
- Chiplet Applications and System-Level Architectures
- Hybrid Bonding Technologies for Die-to-Wafer and Wafer-to-Wafer Integration
- Photonics and Co-Packaged Optics
- Innovation and Sustainability in 3D Integration
- European Readiness in Design, Materials, and Manufacturing
- NextGen Talent: Empowering Careers, Driving Growth
