The Summit will offer insights into the latest heterogeneous integration innovations that are strengthening Europe’s semiconductor resilience and powering the next generation of intelligent systems. Registration is open.
Themed Heterogenous Integration: Bolstering Europe’s Resilience, this year’s Summit will feature an expanded program covering geopolitical dynamics, market trends, chiplet design, as well as the latest advancements in chiplet applications and hybrid bonding techniques.
“We look forward to welcoming industry leaders, innovators, and researchers to showcase their latest technologies and developments at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “As Europe advances in chiplet architectures, hybrid bonding, and co-packaged optics, the Summit provides a unique platform to drive collaboration and highlight the innovations shaping the future of semiconductors.”
3D & Systems Summit Sessions
NextGen Talent: Empowering Careers, Driving Growth
Featuring insights from semiconductor leaders, educators, and students, this session will highlight best practices for attracting, developing, and retraining top talent. Experts will discuss strategies that foster innovation, bridge talent gap, and create meaningful career opportunities—key to securing Europe’s continued leadership in the semiconductor industry.
Session 1: Geopolitical Dynamics and Market Trends
Executive leaders will examine how geopolitical dynamics are reshaping the semiconductor industry, highlighting Europe’s strategic role amid global demand shifts and supply chain disruptions.
Session 2: Chiplet Applications: System Level Architectures
Industry experts will explore the diverse applications of chiplet technology in various fields, highlighting the conceptual aspects of design and 3D integration.
Session 3: Hybrid Bonding – Die to Wafer
Specialists will focus on die-to-wafer hybrid bonding and its role in enabling advanced 3D integration, with insights into scalability, cost-effectiveness, and the roadmap for industry adoption.
Session 4: Hybrid Bonding – Wafer to Wafer
Experts will discuss wafer-to-wafer hybrid bonding technologies and examine the current state of these technologies as well as the technical and market challenges they face.
Session 5: Photonics and Co-Package Optics
Industry leaders will share insights into the integration of photonics and co-package optics, and how these advancements can drive innovation and efficiency across diverse industries.
Session 6: European Readiness: Design, Materials, Manufacturing
Visionaries will explore the design, materials, and manufacturing scalability of technologies, highlighting key challenges, cost-effective factors, and innovative solutions for advancing 3D integrated circuits and chiplet production.
