Italy-based SECO is highlighting its portfolio of embedded computing solutions, including hardware and software designed for artificial intelligence (AI) at the Edge, at embedded world North America.
The company is presenting its latest system-on-modules (SOMs), industrial PCs, and the Clea software framework, which manages AI, Internet of Things (IoT) devices, and cybersecurity.
Visitors to SECO’s booth will be able to see live demonstrations of AI-powered image generation, gesture recognition, and real-time computer vision applications, underscoring the company’s partnerships with Qualcomm, MediaTek, NXP, Intel, and Axelera AI.
Among the hardware highlights is the SOM-COMe-CT6-Snapdragon-X, powered by Qualcomm’s Snapdragon X series processors and a Hexagon neural processing unit capable of 45 trillion operations per second (TOPS). Another module, the SOM-SMARC-MX95, integrates NXP’s i.MX 95 processor with six Cortex-A55 cores and a dual Cortex-M microcontroller, delivering 2 TOPS for AI and machine learning workloads in constrained environments.
The newly released Clea OS 2.0, an industrial-grade embedded Linux operating system, is designed to accelerate edge IoT deployment. Built on the Yocto Project, it is compatible with both SECO’s own products and third-party hardware, facilitating cloud integration, remote device management, and compliance with European Union cybersecurity regulations.
