The topics include:
* PCB Material Selection For High Speed Design: This seminar will discuss different types of laminate systems that can be chosen for various design applications. We will emphasize the predictability of losses, the use of various types of copper foil treatments, and the impact of fiberglass weave.
* Connector Figures Of Merit: This seminar will discuss relative figures of merits for connectors and how to use them in selecting a connector for a particular design. Emphasis will be on data available on-line from Samtec.
* High Fidelity Signal Integrity Modelling: This seminar will discuss the need for precise signal integrity modeling for high performance systems. This will include a discussion on making accurate measurements, material properties, benchmarking of electromagnetic solvers to measurements, and statistical analysis.
