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BTU will showcase New PYRAMAX Capabilities at NEPCON South China 2012

7th August 2012
Nat Bowers
0

BTU have today announced that it will highlight new High Efficiency flux management and dual-lane, dual-speed capabilities of its PYRAMAX solder reflow system, as well as the latest WINCON 5.0 control software in booth #1J10 at the NEPCON South China 2012. The electronics manufacturing showcase event is scheduled to take place August 28-30, 2012, at the Shenzhen Convention & Exhibition Center, China.

PYRAMAX reflow ovens set the industry standard for thermal performance, providing electronics manufacturers with the highest throughput to compete successfully in today’s challenging marketplace. The HE flux management system incorporates a new design that ensures clean oven operation that further extends the maintenance cycle. The HE flux management system collects flux residue by processing oven atmosphere from multiple extraction points through a series of heat exchangers. To reduce downtime, the HE flux management system is designed to allow service while the oven is in production (true on-the-fly maintenance).

Dual-lane reflow ovens are now being used to double throughput in a single reflow oven by allowing two boards to be run at the same time in parallel, with identical or nearly identical boards. By using dual-speed, it is possible to achieve independent thermal profiles and run boards with significant differences, simultaneously, adding further flexibility to the already doubled throughput. The newly-launched WINCON 5.0 control system software offers true dual process capability with the ability to adjust one lane while the other lane continues production.

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